Compact front-loading modular PVD system
MiniLab 030 Compact Modular PVD System
Front-loading modular PVD for compact research labs, glovebox integration and flexible thin-film process development.
MiniLab 030 gives research teams a compact 30 L-class MiniLab platform with magnetron sputtering, thermal and low-temperature evaporation, e-beam capability and configurable substrate handling in a practical front-loading chamber format.
Overview
Compact modular PVD capability in a front-loading chamber
MiniLab 030 is designed for laboratories that need the flexibility of the MiniLab architecture in a compact footprint. The front-loading chamber supports practical daily access while retaining configurable source, substrate and gas-control options for thin-film research.
The platform can be configured for magnetron sputtering, thermal evaporation, low-temperature evaporation and e-beam deposition, with glovebox integration available for sensitive materials and protected-transfer work.
Best-fit profile
- Compact university and R&D laboratories
- Front-loading chamber access
- Sputtering, evaporation and e-beam configurations
- Glovebox-integrated or standalone layouts
- Small-batch thin-film process development
Typical configurations
Build the platform around your process needs
Compact sputtering platform
Configure up to three magnetron sputter sources with manual or automatic gas/pressure control and QCM monitoring for repeatable thin-film development.
- Up to 3 x 2 inch sputter sources
- Manual or automatic MFC/throttle valve control
- QCM rate and thickness monitoring
Hybrid evaporation and sputtering
Combine sputtering with thermal, low-temperature or e-beam evaporation where your material set requires more than one deposition approach.
- Dual thermal evaporation source options
- Low-temperature evaporation for compatible materials
- E-beam evaporation by configuration
Glovebox-integrated research
Use a glovebox mating interface or retrofit option to support sensitive material handling and protected transfer workflows where atmospheric exposure is a concern.
- Glovebox mating interface / retrofit
- Compact front-loading chamber
- Useful for OLED, OPV and sensitive thin-film research
Key features
Research-grade flexibility without a large footprint
Front-loading chamber
Ergonomic access for loading substrates, servicing sources and supporting daily research use.
Compact modular footprint
Approx. 590 x 590 mm single-rack footprint, with double-rack layouts available where required.
Multi-technique deposition
Supports magnetron sputtering, thermal evaporation, low-temperature evaporation and e-beam configurations.
Glovebox integration
Can be specified with a glovebox mating interface or retrofit option for protected workflows.
Configurable substrate handling
Substrate heating, rotation, Z-shift, cooling and bias options can be specified by application.
Future-ready baseplate
Retrofittable, reconfigurable platform architecture supports future process changes and upgrades.
Options and upgrades
Configure the platform around the source, substrate, gas-control and lab-integration requirements of your research programme. Options are confirmed with quotation for the final build.
Vacuum and transfer
- Turbomolecular pump with rotary or scroll backing pump
- CF100 rear-mounted turbo port
- Glovebox mating interface / retrofit
- Process gas expansion
Sources and power
- Up to 3 sputter sources
- Dual thermal evaporation sources
- Low-temperature evaporation sources
- E-beam evaporation by configuration
Control and substrate handling
- Touchscreen HMI and/or Windows PC control
- Manual or automatic MFC/throttle valve control
- Substrate heating, rotation and Z-shift
- Substrate cooling
- RF + DC substrate bias
- QCM rate/thickness monitoring
- Optional etch module integration
Technical specifications
MiniLab 030 specification overview
| System type | Compact modular PVD / vacuum deposition system |
|---|---|
| Chamber style | Front-loading vacuum chamber |
| Chamber material | 304L stainless steel |
| Chamber volume | Approx. 30 L chamber class |
| Footprint | Approx. 590 x 590 mm single-rack footprint; double racks available |
| Mounting | Floor-standing compact rack system / glovebox integrated |
| Base pressure | <5 x 10-7 mbar |
| Pumping | Turbomolecular pump with rotary or scroll backing pump |
| Turbo port | CF100 rear-mounted turbo port |
| Substrate capacity | Up to 6-inch diameter substrates |
| Source capacity | Up to 3 sputter sources or multiple evaporation sources |
| Deposition methods | Magnetron sputtering, thermal evaporation, low-temperature evaporation and e-beam evaporation |
| Materials supported | Metals, dielectrics and organics |
| Substrate options | Heating, rotation, Z-shift, cooling and bias |
| Process monitoring | QCM thickness/rate monitoring |
| Control system | Touchscreen HMI and/or Windows PC |
| Gas control | Manual or automatic MFC/throttle valve control |
| Glovebox integration | Glovebox mating interface / retrofit option |
| Cleanroom compatibility | Cleanroom compatible |
| Safety | Full interlocks and safety systems |
Exact specifications depend on final configuration.
Applications
Supports compact modular deposition workflows for materials research, organic electronics, device prototyping and sensitive thin-film development.
OLED and OPV research
Graphene and 2D materials
Semiconductor research
Thin-film R&D
Organic thin films
Dielectrics and metals
Glovebox-integrated processes
Exploratory device stacks
Resources and related systems
Configure MiniLab 030 around your research workflow
Tell us about your material set, substrate size, deposition sources, glovebox needs and target film stack. Moorfield can help specify whether MiniLab 030 is the right fit or whether another MiniLab platform is more appropriate.