Benchtop PVD System
nanoPVD-S10A Benchtop PVD System
Compact, research-grade RF/DC magnetron sputtering for advanced thin-film materials.
The nanoPVD-S10A brings high-performance sputtering capability into a compact benchtop platform, supporting metals, oxides, nitrides, multilayers, and exploratory materials R&D.
Product gallery
nanoPVD-S10A
image carousel
Research-grade sputtering in a compact benchtop platform
The nanoPVD-S10A is compact enough for research laboratories and cleanrooms, while using high-end vacuum, source and control hardware for controlled thin-film deposition. It is optimised for RF and DC magnetron sputtering of metals and insulating materials, giving research teams a practical platform for repeatable materials development.
- Compact footprint for research labs and cleanrooms
- RF/DC compatibility for a broad material range
- Configurable sources and gas handling
- Recipe-driven operation via touchscreen HMI
- Designed for serviceability and long-term use
Benefits that matter in a working research lab
Faster experimental cycles
Keep early-stage sputtering work close to the research group, reduce waiting time and make process changes without competing for flagship cleanroom capacity.
Ease of use for mixed-experience teams
A touchscreen HMI, compact layout and straightforward maintenance help new users build confidence while still working on genuine research-grade sputtering processes.
Research-grade flexibility
RF and DC sputtering capability supports metals and insulating materials, including reactive and co-deposition methods for more advanced film stacks.
Lower operational friction
The benchtop format helps departments add local PVD capability without creating the access, facility and training burden associated with larger infrastructure.
Better use of premium tools
Develop and screen baseline recipes locally, then transfer mature work to larger shared systems only when the process is ready.
Designed for real devices
Useful for contact layers, seed films, functional coatings, TCO/dielectric studies, reactive sputtering and multi-material research workflows.
Key features for thin-film process development
Compact benchtop design
Advanced PVD capability in a space-efficient format for research labs, teaching spaces and cleanrooms.
RF/DC magnetron sputtering
DC sputtering for conductive materials and RF sputtering for conductive and non-conductive materials such as oxides and nitrides.
High-vacuum performance
Turbomolecular pumping supports low-contamination operation with base pressure below 5E-07 mbar.
Reactive sputtering capability
Gas and pressure control can support up to three process gases for oxide, nitride and compound film development.
Recipe-based touchscreen control
Touchscreen HMI with fully automatic operation and the ability to define and save multiple process recipes.
Configurable source and gas options
Up to three water-cooled magnetron sources for industry-standard 2 inch targets, with co-deposition and reactive process options.
Typical nanoPVD-S10A configurations
Start with a proven configuration, then tailor source, gas, stage and monitoring options around your materials and target films.
Metals deposition
For conductive films, contact metals, electrodes and exploratory materials work where reliable DC sputtering and practical geometry control matter.
- Two magnetrons with DC power supply
- SputterSwitch module for shared output
- Substrate Z-shift and bi-shutter for best 4 inch substrate geometries
- Quartz crystal sensor head for rate and thickness calibration
TCO / dielectrics sputtering
For transparent conductive oxides, dielectric coatings and process approaches that benefit from RF power and oxygen control.
- Two magnetrons with RF power supply
- SputterSwitch module for shared output
- Substrate heating and additional oxygen process gas line
- Substrate Z-shift, bi-shutter and quartz crystal sensor head
Reactive / co-deposition
For flexible materials R&D where researchers need source routing, multiple gases and mixed RF/DC process capability.
- Three magnetrons with RF and DC power supplies
- SputterSwitch for flexible power supply/source routing
- Three process gases, for example argon, oxygen and nitrogen
- Reactive deposition of oxides and nitrides
Options and upgrades
Configure the platform around the process approach, substrate handling, automation and laboratory services your application needs. Options are confirmed with quotation for the final build.
Vacuum and gas handling
- Dry backing pump
- Fast chamber vent
- Capacitance manometer and optional MFC closed-loop pressure control
- Up to 3 MFC-controlled process gases
Deposition and power
- Up to 3 x 2 inch water-cooled magnetron sputtering sources
- 780 W DC and/or 150 W, 13.56 MHz RF power supplies with auto-match
- High-strength magnet pack for magnetic target sputtering
- SputterSwitch source/power routing where specified
- In-situ rate and thickness monitoring
Substrate handling
- Substrate heating up to 500°C; up to 600°C with 4-bulb configuration
- Substrate cooling option
- RF and DC substrate bias option
- Rotation, Z-shift and shutters where specified
Technical specifications
Exact specifications depend on final configuration and should be confirmed with quotation.
Best-fit research profile
Best used where compact RF/DC sputtering, reactive process options and local recipe screening are needed for 4 inch research substrates.